Pedestal of heat insulating cylinder for manufacturing semiconductor wafers

Description

FIG. 1 is front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken through line 8--8 of FIG. 2; and,

FIG. 9 is a front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers in use.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a pedestal of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

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Inventors:	Sato; Izumi (Oshu, JP)
Assignee:	Tokyo Electron Limited (Minato-Ku, JP)
Appl. No.:	D/342,850
Filed:	September 2, 2009

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Foreign Application Priority Data

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Mar 6, 2009 [JP]			2009-004985

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;206/454,711 ;118/728,729 ;211/41.18 ;432/241,253,258

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References Cited [Referenced By]

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U.S. Patent Documents

5494524	February 1996	Inaba et al.
5743967	April 1998	Kobori et al.
5752609	May 1998	Kato et al.
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6099302	August 2000	Hong et al.
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D580894	November 2008	Sato
7484958	February 2009	Kobayashi

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Burr & Brown