Heat dissipation device
Lin , et al. May 25, 2
U.S. patent number D616,382 [Application Number D/346,029] was granted by the patent office on 2010-05-25 for heat dissipation device. This patent grant is currently assigned to Foxsemicon Integrated Technology, Inc.. Invention is credited to Shan-Ju Lin, Hong-Bin Yang.
| United States Patent | D616,382 |
| Lin , et al. | May 25, 2010 |
Heat dissipation device
Claims
CLAIM The ornamental design for a heat dissipation device, as shown.
| Inventors: | Lin; Shan-Ju (Miao-Li Hsien, TW), Yang; Hong-Bin (Miao-Li Hsien, TW) |
|---|---|
| Assignee: | Foxsemicon Integrated Technology,
Inc. (Chu-Nan, Miao-Li Hsien, TW) |
| Appl. No.: | D/346,029 |
| Filed: | October 26, 2009 |
Foreign Application Priority Data
| Jul 21, 2009 [CN] | 2009 3 0309767 | |||
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719 |
References Cited [Referenced By]
U.S. Patent Documents
| D306491 | March 1990 | Hallengren |
| D315832 | April 1991 | Rocheleau et al. |
| D338449 | August 1993 | Sahyoun |
| 5746502 | May 1998 | Huang |
| D500883 | January 2005 | Herst et al. |
| D520172 | May 2006 | Engel |
| D538053 | March 2007 | Fischer |
| 7422347 | September 2008 | Miyairi et al. |
| 7438441 | October 2008 | Sun et al. |
| 7535030 | May 2009 | Lin |
| D595443 | June 2009 | Tran et al. |
| D606501 | December 2009 | Plonski et al. |
| 2005/0243576 | November 2005 | Park et al. |
| 2006/0146531 | July 2006 | Reo et al. |
| 2009/0002978 | January 2009 | Tran et al. |
Attorney, Agent or Firm: Chew; Raymond J.
Description
FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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