Heat dissipation device Patent Grant Chang , et al. May 25, 2 [Foxsemicon Integrated Technology, Inc.]

Heat dissipation device

Chang , et al. May 25, 2

Patent Grant D616380

U.S. patent number D616,380 [Application Number D/344,387] was granted by the patent office on 2010-05-25 for heat dissipation device. This patent grant is currently assigned to Foxsemicon Integrated Technology, Inc.. Invention is credited to Hsueh-Chen Chang, Shan-Ju Lin.

United States Patent	D616,380
Chang , et al.	May 25, 2010

Heat dissipation device

Claims

CLAIM The ornamental design for a heat dissipation device, as shown.

Inventors:	Chang; Hsueh-Chen (Miao-Li Hsien, TW), Lin; Shan-Ju (Miao-Li Hsien, TW)
Assignee:	Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien, TW)
Appl. No.:	D/344,387
Filed:	September 29, 2009

Foreign Application Priority Data


Jun 18, 2009 [CN]			2009 3 0306391.X

Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719

References Cited [Referenced By]

U.S. Patent Documents


D286396	October 1986	Luciano
5464054	November 1995	Hinshaw et al.
D376132	December 1996	Orton
D378815	April 1997	Dodson
6196302	March 2001	Chuang
6343014	January 2002	Lin
6648065	November 2003	Huang et al.
6874566	April 2005	Artman et al.
D529873	October 2006	He et al.
7440282	October 2008	Brandenburg et al.
2005/0078456	April 2005	Mandel et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Chew; Raymond J.

Description

FIG. 1 is a perspective view of a heat dissipation device showing our new design.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a left-side, elevational view thereof.

FIG. 5 is a right-side, elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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