Emitter package

Description

FIG. 1 is a perspective view of the first embodiment of an emitter package showing our design;

FIG. 2 is a top plan view of the emitter package shown in FIG. 1;

FIG. 3 is a bottom plan view of the emitter package shown in FIG. 1;

FIG. 4 is front elevation view of the emitter package shown in FIG. 1, with the back elevation view being a mirror image thereof;

FIG. 5 is a right side elevation view of the emitter package shown in FIG. 1, with the left side elevation view being a mirror image thereof;

FIG. 6 is a bottom perspective view of the emitter package shown in FIG. 1;

FIG. 7 is a top perspective view of the second embodiment of an emitter package showing our design;

FIG. 8 is a top plan view of the emitter package shown in FIG. 7;

FIG. 9 is a bottom plan view of the emitter package shown in FIG. 7;

FIG. 10 is front elevation view of the emitter package shown in FIG. 7, with the back elevation view being a mirror thereof;

FIG. 11 is a right side elevation view of the emitter package shown in FIG. 7, with the left side elevation view being a mirror image thereof;

FIG. 12 is a bottom perspective view of the emitter package shown in FIG. 7;

FIG. 13 is a perspective view of the third embodiment of an emitter package showing our design;

FIG. 14 is a top plan view of the emitter package shown in FIG. 13;

FIG. 15 is a bottom plan view of the emitter package shown in FIG. 13;

FIG. 16 is front elevation view of the emitter package shown in FIG. 13, with the back elevation view being a mirror image thereof;

FIG. 17 is a right side elevation view of the emitter package shown in FIG. 13, with the left side elevation view being a mirror image thereof;

FIG. 18 is a bottom perspective view of the emitter package shown in FIG. 13;

FIG. 19 is a perspective view of the fourth embodiment of an emitter package showing our design;

FIG. 20 is a top plan view of the emitter package shown in FIG. 19;

FIG. 21 is a bottom plan view of the emitter package shown in FIG. 19;

FIG. 22 is front elevation view of the emitter package shown in FIG. 19, with the back elevation view being a mirror image thereof;

FIG. 23 is a right side elevation view of the emitter package shown in FIG. 19, with the left side elevation view being a mirror image thereof;

FIG. 24 is a bottom perspective view of the emitter package shown in FIG. 19;

FIG. 25 is a perspective view of the fifth embodiment of an emitter package showing our design;

FIG. 26 is a top plan view of the emitter package shown in FIG. 25;

FIG. 27 is a bottom plan view of the emitter package shown in FIG. 25;

FIG. 28 is front elevation view of the emitter package shown in FIG. 25, with the back elevation view being a mirror image thereof;

FIG. 29 is a right side elevation view of the emitter package shown in FIG. 25, with the left side elevation view being a mirror image thereof;

FIG. 30 is a bottom perspective view of the emitter package shown in FIG. 25;

FIG. 31 is a perspective view of the sixth embodiment of an emitter package showing our design;

FIG. 32 is a top plan view of the emitter package shown in FIG. 31;

FIG. 33 is a bottom plan view of the emitter package shown in FIG. 31;

FIG. 34 is front elevation view of the emitter package shown in FIG. 31, with the back elevation view being a mirror image thereof;

FIG. 35 is a right side elevation view of the emitter package shown in FIG. 31, with the left side elevation view being a mirror image thereof; and,

FIG. 36 is a bottom perspective view of the emitter package shown in FIG. 31.

The broken line showing in the embodiments of FIGS. 1 6, 13 18, 19 24 and 25 30 are for illustrative purposes only and forms no part of the claimed design. The external surface having stippling or irregular lines in the embodiments of FIGS. 25 30 and 31 36 indicate a rough visual appearance of the side surfaces of the emitter package. The top layer can have be visually transparent or translucent as shown in the embodiments of FIGS. 1 6, 13 18, 19 24 and 25 30, and in some embodiments can optically distort the layer below.

Claims

CLAIM The ornamental design for an emitter package, as shown and described.

---

Inventors:	Keller; Bernd (Santa Barbara, CA), Medendorp, Jr.; Nicholas (Raleigh, NC), Yuan; Thomas Cheng-Hsin (Ventura, CA)
Assignee:	Cree, Inc. (Goleta, CA)
Family ID:	42139755
Appl. No.:	D/292,900
Filed:	October 31, 2007

---

Current U.S. Class:	D13/180
Current CPC Class:	H01L2224/49113 20130101
Current International Class:	1303
Field of Search:	;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100 ;313/483,498,500 ;362/555,800

---

References Cited [Referenced By]

---

U.S. Patent Documents

3760237	September 1973	Jaffe
4307297	December 1981	Groff
4511425	April 1985	Boyd et al.
5040868	August 1991	Waitl
5130761	July 1992	Tanaka
5167556	December 1992	Stein
5703401	December 1997	van de Water
5706177	January 1998	Nather
5790298	August 1998	Tonar
5813753	September 1998	Vriens et al.
5907151	May 1999	Gramann
5959316	September 1999	Lowery
6061160	May 2000	Maruyama
6066861	May 2000	Hohn
6183100	February 2001	Suckow et al.
6259608	July 2001	Berardinelli et al.
6296367	October 2001	Parsons et al.
6359236	March 2002	DiStefano et al.
6376902	April 2002	Arndt
6454437	September 2002	Kelly
6469321	October 2002	Arndt
6498355	December 2002	Harrah et al.
6573580	June 2003	Arndt
6610563	August 2003	Waitl
6614058	September 2003	Lin et al.
6624491	September 2003	Waitl et al.
6680490	January 2004	Yasukawa et al.
6686609	February 2004	Sung
6707069	March 2004	Song et al.
6710373	March 2004	Wang
6759733	July 2004	Arndt
6770498	August 2004	Hsu
6774401	August 2004	Nakada et al.
6858879	February 2005	Waitl
6872585	March 2005	Matsumura et al.
6876149	April 2005	Miyashita
6900511	May 2005	Ruhnau et al.
6911678	June 2005	Fujisawa et al.
6919586	July 2005	Fujii
6940704	September 2005	Stalions
6946714	September 2005	Waitl
6975011	December 2005	Arndt
6995510	February 2006	Murakami et al.
7021797	April 2006	Minano et al.
7064907	June 2006	Kaneko
7066626	June 2006	Omata
7102213	September 2006	Sorg
7119422	October 2006	Chin
7224000	May 2007	Aanegola et al.
7285802	October 2007	Ouderkirk et al.
D572210	July 2008	Lee
D572670	July 2008	Ono et al.
D576574	September 2008	Kobayakawa
2002/0061174	May 2002	Hurt et al.
2002/0123163	September 2002	Fujii
2002/0163001	November 2002	Shaddock
2002/0171911	November 2002	Maegawa
2002/0195935	December 2002	Jager
2003/0183852	October 2003	Takenaka
2004/0041222	March 2004	Loh
2004/0047151	March 2004	Bogner et al.
2004/0079957	April 2004	Andrews et al.
2004/0080939	April 2004	Braddell et al.
2004/0126913	July 2004	Loh
2004/0227149	November 2004	Ibbetson
2004/0232435	November 2004	Hofer
2004/0238930	December 2004	Arndt
2005/0023548	February 2005	Bhat
2005/0051789	March 2005	Negley et al.
2005/0072981	April 2005	Suenaga
2005/0077535	April 2005	Li
2005/0093005	May 2005	Ruhnau
2005/0127377	June 2005	Arndt
2005/0177320	June 2005	Leu et al.
2005/0152127	July 2005	Kamiya et al.
2005/0179376	August 2005	Fung et al.
2006/0022212	February 2006	Waitl
2006/0049477	March 2006	Arndt
2006/0108594	May 2006	Iwasaki et al.
2006/0157828	July 2006	Sorg
2006/0220046	October 2006	Yu et al.
2007/0269586	November 2007	Leatherdale
2008/0074032	March 2008	Yano et al.

Foreign Patent Documents

	1581527		Feb 2005		CN
	1591924		Mar 2005		CN
	1679168		Oct 2005		CN
	1744335		Aug 2006		CN
	1005085		May 2000		EP
	1187226		Mar 2002		EP
	1187227		Mar 2002		EP
	1187228		Mar 2002		EP
	1521313		Apr 2005		EP
	8139257		May 1996		JP
	2000223752		Nov 2000		JP
	WO 9931737		Jun 1999		WO
	WO0217405		Feb 2002		WO
	WO 04027882		Apr 2004		WO
	WO04044877		May 2004		WO
	WO05043627		May 2005		WO
	WO 05104247		Nov 2005		WO
	WO 06054228		May 2006		WO
	WO 06054228		May 2006		WO

Other References

JP 2001 060072A , Abstract, Matsushita Electric Ind. Co Ltd., March 6, 222001. cited by other . Nichia Corp. White LED Part No. NSPW300BS, Specification for Nichia White LED , Model NSPW300BS., Jan. 14, 2004. cited by other . Nicha Corp., White LED Part No. NSPW312BS, Specification for Nichia White Led, Model NSPW312BS. Jan. 14, 2004. cited by other . Kim J.K et al. "Strongly Enhanced Phosphor Efficiency in GaInN White Light-Emitting Diodes Using Remote Phosphor Configuration and Diffuse Reflector Cup" Japanese Journal of Applied Physics, Japan Society of Applied Physics, Tokyo, JP, vol. 44, No. 20-23, Jan. 1, 2005 XP-001236966, pp. 649-651. cited by other.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Koppel, Patrick, Heybl & Dawson