Earphone

Description

FIG. 1 is a front right top perspective view of a first embodiment of an earphone showing our new design;

FIG. 2 is a rear right top perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a side elevational view thereof;

FIG. 6 is an opposite side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front right top perspective view of a second embodiment of an earphone showing our new design;

FIG. 10 is a rear right top perspective view thereof;

FIG. 11 is a front elevational view thereof;

FIG. 12 is a rear elevational view thereof;

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof;

FIG. 17 is a front right top perspective view of a third embodiment of an earphone showing our new design;

FIG. 18 is a front elevational view thereof;

FIG. 19 is a rear elevational view thereof;

FIG. 20 is a left side elevational view thereof;

FIG. 21 is a right side elevational view thereof;

FIG. 22 is a top plan view thereof;

FIG. 23 is a bottom plan view thereof;

FIG. 24 is a front right top perspective view of a fourth embodiment of an earphone showing our new design;

FIG. 25 is a front elevational view thereof;

FIG. 26 is a rear elevational view thereof;

FIG. 27 is a left side elevational view thereof;

FIG. 28 is a right side elevational view thereof;

FIG. 29 is a top plan view thereof;

FIG. 30 is a bottom plan view thereof;

FIG. 31 is a front right top perspective view of a fifth embodiment of an earphone showing our new design;

FIG. 32 is a front elevational view thereof;

FIG. 33 is a rear elevational view thereof;

FIG. 34 is a left side elevational view thereof;

FIG. 35 is a right side elevational view thereof;

FIG. 36 is a top plan view thereof;

FIG. 37 is a bottom plan view thereof;

FIG. 38 is a front right top perspective view of a sixth embodiment of an earphone showing our new design;

FIG. 39 is a front elevational view thereof;

FIG. 40 is a rear elevational view thereof;

FIG. 41 is a left side elevational view thereof;

FIG. 42 is a right side elevational view thereof;

FIG. 43 is a top plan view thereof;

FIG. 44 is a bottom plan view thereof;

FIG. 45 is a front right top perspective view of a seventh embodiment of an earphone showing our new design;

FIG. 46 is a rear right top perspective view thereof;

FIG. 47 is a front elevational view thereof;

FIG. 48 is a rear elevational view thereof;

FIG. 49 is a left side elevational view thereof;

FIG. 50 is a right side elevational view thereof;

FIG. 51 is a top plan view thereof; and,

FIG. 52 is a bottom plan view thereof.

The portions indicated in broken lines are for illustrative purposes only and form no part of the claimed design.

Claims

CLAIM The ornamental design for an earphone, as shown and described.

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Inventors:	Densho; Keiko (Tokyo, JP), Shimizu; Yosuke (Tokyo, JP), Sugiyama; Naoki (Tokyo, JP), Shimizu; Naoto (Tokyo, JP), Morimoto; So (Tokyo, JP), Kitayama; Sohei (Tokyo, JP)
Assignee:	Sony Corporation (Tokyo, JP)
Appl. No.:	D/311,145
Filed:	December 31, 2008

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29300195	Feb 29, 2008	D598431
	29300196	Feb 29, 2008	D587247
	29300197	Feb 29, 2008
	29300199	Feb 29, 2008	D587249

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Foreign Application Priority Data

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Aug 31, 2007 [JP]			D2007-023857
Aug 31, 2007 [JP]			D2007-023863
Aug 31, 2007 [JP]			D2007-023864
Aug 31, 2007 [JP]			D2007-023865
Jul 4, 2008 [JP]			D2008-017355
Jul 4, 2008 [JP]			D2008-017356
Jul 31, 2008 [JP]			D2008-019806

Current U.S. Class:	D14/223
Current International Class:	1401
Field of Search:	;D14/205,206,223,188,192 ;181/129,130 ;379/430,433 ;128/864,865 ;D24/106 ;381/381

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Foreign Patent Documents

	1305029		Jun 2007		JP
	1305030		Jun 2007		JP

Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer, PLLC