U.S. patent number D609,654 [Application Number D/335,029] was granted by the patent office on 2010-02-09 for led package.
This patent grant is currently assigned to Everlight Electronic Co., Ltd.. Invention is credited to Chung Chuan Hsieh.
United States Patent |
D609,654 |
Hsieh |
February 9, 2010 |
LED package
Claims
CLAIM The ornamental design for the led package, as shown and as
described.
Inventors: |
Hsieh; Chung Chuan (Taipei,
TW) |
Assignee: |
Everlight Electronic Co., Ltd.
(Taipei, TW)
|
Appl.
No.: |
D/335,029 |
Filed: |
April 7, 2009 |
Foreign Application Priority Data
|
|
|
|
|
Jan 6, 2009 [TW] |
|
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98300019 |
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Current U.S.
Class: |
D13/180 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/180 ;D26/2
;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500
;362/555,800 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Moore & Van Allen PLLC Ransom;
W. Kevin
Description
FIG. 1 is a perspective view showing the led package of my new
design;
FIG. 2 is another perspective view showing the led package of my
new design;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
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