LED package
Hsieh February 9, 2
U.S. patent number D609,654 [Application Number D/335,029] was granted by the patent office on 2010-02-09 for led package. This patent grant is currently assigned to Everlight Electronic Co., Ltd.. Invention is credited to Chung Chuan Hsieh.
| United States Patent | D609,654 |
| Hsieh | February 9, 2010 |
LED package
Claims
CLAIM The ornamental design for the led package, as shown and as described.
| Inventors: | Hsieh; Chung Chuan (Taipei, TW) |
|---|---|
| Assignee: | Everlight Electronic Co., Ltd.
(Taipei, TW) |
| Appl. No.: | D/335,029 |
| Filed: | April 7, 2009 |
Foreign Application Priority Data
| Jan 6, 2009 [TW] | 98300019 | |||
| Current U.S. Class: | D13/180 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100,E33.058 ;313/483,498,500 ;362/555,800 |
References Cited [Referenced By]
U.S. Patent Documents
| D500294 | December 2004 | Ishida |
| D512693 | December 2005 | Kim et al. |
| 7242035 | July 2007 | Kim et al. |
| D576114 | September 2008 | Choi et al. |
| D598872 | August 2009 | In et al. |
| 2002/0149314 | October 2002 | Takahashi et al. |
| 2006/0023451 | February 2006 | Han et al. |
Attorney, Agent or Firm: Moore & Van Allen PLLC Ransom; W. Kevin
Description
FIG. 1 is a perspective view showing the led package of my new design;
FIG. 2 is another perspective view showing the led package of my new design;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
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