Package for electronic device

Description

FIG. 1 is a back view of a first embodiment of a package for electronic device of the present invention.

FIG. 2 is right side view thereof, the left side view being a mirror image;

FIG. 3 is a front view thereof.

FIG. 4 is a front-side perspective view thereof.

FIG. 5 is a front-end perspective view thereof.

FIG. 6 is a back-side perspective view thereof.

FIG. 7 is a back-side perspective view thereof.

FIG. 8 is a back view of a second embodiment of a package for electronic device of the present invention.

FIG. 9 is right side view thereof, the left side view being a mirror image;

FIG. 10 is a front view thereof.

FIG. 11 is a front-side perspective view thereof.

FIG. 12 is a front-end perspective view thereof.

FIG. 13 is a back-side perspective view thereof; and,

FIG. 14 is a back-side perspective view thereof.

Those portions of the package for electronic device shown in broken lines are included for illustrative purposes only and form no part of the claimed design.

Claims

CLAIM The ornamental design for a package for electronic device, as shown and described.

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Inventors:	Feldvoss; Mario (Munich, DE), Griebl; Erich (Dorfen, DE), Lee; Teck Sim (Melaka, MY), Schredl; Juergen (Mering, DE)
Assignee:	Infineon Technologies AG (Neubiberg, DE)
Appl. No.:	D/327,873
Filed:	November 14, 2008

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Foreign Application Priority Data

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Jul 25, 2008 [DE]			DE 40 2008 003 618

Current U.S. Class:	D13/154; D13/164
Current International Class:	1303
Field of Search:	;D13/133,138.1,146,147,154,156,184 ;439/357,358,447,483,586,578,606-610,668-669,678-676,889,892

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References Cited [Referenced By]

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U.S. Patent Documents

D513408	January 2006	Suckle
D543155	May 2007	Suckle
D543157	May 2007	Suckle
D556134	November 2007	Lee et al.

Primary Examiner: Bondade; Nanda
Attorney, Agent or Firm: Dicke, Billig & Czaja, PLLC