| Patent | Date |
|---|
Semiconductor component having inner and outer semiconductor component housings
Grant 9,991,183 - Hoeglauer , et al. June 5, 2 | 2018-06-05 |
Chip carrier structure, chip package and method of manufacturing the same
Grant 9,824,958 - Otremba , et al. November 21, 2 | 2017-11-21 |
Lateral element isolation device
Grant 9,786,584 - Otremba , et al. October 10, 2 | 2017-10-10 |
Semiconductor housing with rear-side structuring
Grant 9,627,292 - Otremba , et al. April 18, 2 | 2017-04-18 |
Semiconductor packages having multiple lead frames and methods of formation thereof
Grant 9,449,902 - Otremba , et al. September 20, 2 | 2016-09-20 |
Method for manufacturing a chip arrangement
Grant 9,412,626 - Otremba , et al. August 9, 2 | 2016-08-09 |
Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
Grant 9,397,018 - Otremba , et al. July 19, 2 | 2016-07-19 |
Electronic device
Grant 9,362,240 - Hosseini , et al. June 7, 2 | 2016-06-07 |
Semiconductor Component Having Inner and Outer Semiconductor Component Housings
App 20160111346 - Hoeglauer; Josef ; et al. | 2016-04-21 |
Method For Manufacturing A Chip Arrangement
App 20160064255 - Otremba; Ralf ; et al. | 2016-03-03 |
Power transistor arrangement and package having the same
Grant 9,263,440 - Otremba , et al. February 16, 2 | 2016-02-16 |
Electronic device and method for fabricating an electronic device
Grant 9,230,880 - Otremba , et al. January 5, 2 | 2016-01-05 |
Chip arrangements and methods for manufacturing a chip arrangement
Grant 9,184,066 - Otremba , et al. November 10, 2 | 2015-11-10 |
Package-in-packages and methods of formation thereof
Grant 9,147,628 - Otremba , et al. September 29, 2 | 2015-09-29 |
Semiconductor power device having a heat sink
Grant 9,147,631 - Otremba , et al. September 29, 2 | 2015-09-29 |
Chip module, an insulation material and a method for fabricating a chip module
Grant 9,117,786 - Otremba , et al. August 25, 2 | 2015-08-25 |
Power transistor arrangement and method for manufacturing the same
Grant 9,099,441 - Otremba , et al. August 4, 2 | 2015-08-04 |
Electronic Device and Method for Fabricating an Electronic Device
App 20150214133 - Otremba; Ralf ; et al. | 2015-07-30 |
Electronic Device
App 20150162287 - Hosseini; Khalil ; et al. | 2015-06-11 |
Semiconductor device using diffusion soldering
Grant 8,975,117 - Otremba , et al. March 10, 2 | 2015-03-10 |
Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof
App 20150060878 - Otremba; Ralf ; et al. | 2015-03-05 |
Semiconductor packages having multiple lead frames and methods of formation thereof
Grant 8,896,106 - Otremba , et al. November 25, 2 | 2014-11-25 |
Semiconductor Power Device Having a Heat Sink
App 20140312360 - Otremba; Ralf ; et al. | 2014-10-23 |
Chip And Chip Arrangement
App 20140306331 - Otremba; Ralf ; et al. | 2014-10-16 |
Package arrangement and a method of manufacturing a package arrangement
Grant 8,853,849 - Otremba , et al. October 7, 2 | 2014-10-07 |
Package Arrangement And A Method Of Manufacturing A Package Arrangement
App 20140252537 - Otremba; Ralf ; et al. | 2014-09-11 |
Chip Carrier Structure, Chip Package And Method Of Manufacturing The Same
App 20140252577 - Otremba; Ralf ; et al. | 2014-09-11 |
Power Transistor Arrangement And Package Having The Same
App 20140225124 - Otremba; Ralf ; et al. | 2014-08-14 |
Power Transistor Arrangement And Method For Manufacturing The Same
App 20140217596 - Otremba; Ralf ; et al. | 2014-08-07 |
Chip Arrangement, A Method For Manufacturing A Chip Arrangement, Integrated Circuits And A Method For Manufacturing An Integrated Circuit
App 20140197552 - Otremba; Ralf ; et al. | 2014-07-17 |
Chip Module, an Insulation Material and a Method for Fabricating a Chip Module
App 20140151856 - Otremba; Ralf ; et al. | 2014-06-05 |
Chip Arrangements And Methods For Manufacturing A Chip Arrangement
App 20140138803 - Otremba; Ralf ; et al. | 2014-05-22 |
Multi-chip package and method of manufacturing thereof
Grant 8,698,293 - Otremba , et al. April 15, 2 | 2014-04-15 |
Semiconductor Housing with Rear-Side Structuring
App 20140084449 - Otremba; Ralf ; et al. | 2014-03-27 |
Lateral Element Isolation Device
App 20140063766 - Otremba; Ralf ; et al. | 2014-03-06 |
Power semiconductor chip having two metal layers on one face
Grant 8,643,176 - Otremba , et al. February 4, 2 | 2014-02-04 |
Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof
App 20140008702 - Otremba; Ralf ; et al. | 2014-01-09 |
Package-In-Packages and Methods of Formation Thereof
App 20140001615 - Otremba; Ralf ; et al. | 2014-01-02 |
Multi-Chip Package and Method of Manufacturing Thereof
App 20130313712 - Otremba; Ralf ; et al. | 2013-11-28 |
Semiconductor Device Using Diffusion Soldering
App 20130200532 - Otremba; Ralf ; et al. | 2013-08-08 |
Semiconductor Device and Fabrication Method
App 20130154123 - Poh; Yong Chern ; et al. | 2013-06-20 |
Power Semiconductor Chip Having Two Metal Layers on One Face
App 20130027113 - Otremba; Ralf ; et al. | 2013-01-31 |
Semiconductor module for a switched-mode power supply and method for its assembly
Grant 7,923,827 - Heng , et al. April 12, 2 | 2011-04-12 |
Semiconductor device
Grant 7,821,141 - Yong , et al. October 26, 2 | 2010-10-26 |
Package for electronic device
Grant D609,191 - Feldvoss , et al. February 2, 2 | 2010-02-02 |
Semiconductor component having a semiconductor die and a leadframe
Grant 7,629,676 - Otremba , et al. December 8, 2 | 2009-12-08 |
Semiconductor Device
App 20090212417 - Yong; Wae Chet ; et al. | 2009-08-27 |
Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly
App 20090001535 - Heng; Yang Hong ; et al. | 2009-01-01 |
Semiconductor component having a semiconductor die and a leadframe
App 20080061413 - Otremba; Ralf ; et al. | 2008-03-13 |
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