Heat dissipating unit

Description

FIG. 1 is a perspective view of a heat dissipating unit showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side, elevational view thereof;

FIG. 5 is a right-side, elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken line showing of portion of the heat dissipating unit is for illustrative purpose only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for a heat dissipating unit, as shown and described.

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Inventors:	Chen; Bishou (Shanghai, CN), Wang; Yinghua (Shanghai, CN), Wang; Peng (Shanghai, CN), Li; Sheng (Shanghai, CN), Gu; Xiaodong (Shanghai, CN)
Assignee:	Shanghai Sansi Technology Co., Ltd (Shanghai, CN) Shanghai Sansi Electronics Engineering Co., Ltd (Shanghai, CN)
Appl. No.:	D/326,900
Filed:	October 27, 2008

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Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719

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References Cited [Referenced By]

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U.S. Patent Documents

6330908	December 2001	Lee et al.
6557626	May 2003	O'Sullivan et al.
D481688	November 2003	Lee et al.
7038913	May 2006	Lee et al.
2004/0226690	November 2004	Lee et al.
2006/0060332	March 2006	Wang et al.
2007/0253202	November 2007	Wu et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Sughrue Mion, PLLC