U.S. patent number D606,502 [Application Number D/326,900] was granted by the patent office on 2009-12-22 for heat dissipating unit. This patent grant is currently assigned to Shanghai Sansi Electronics Engineering Co., Ltd, Shanghai Sansi Technology Co., Ltd. Invention is credited to Bishou Chen, Xiaodong Gu, Sheng Li, Peng Wang, Yinghua Wang.
United States Patent | D606,502 |
Chen , et al. | December 22, 2009 |
Inventors: | Chen; Bishou (Shanghai, CN), Wang; Yinghua (Shanghai, CN), Wang; Peng (Shanghai, CN), Li; Sheng (Shanghai, CN), Gu; Xiaodong (Shanghai, CN) |
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Assignee: | Shanghai Sansi Technology Co.,
Ltd (Shanghai, CN) Shanghai Sansi Electronics Engineering Co., Ltd (Shanghai, CN) |
Appl. No.: | D/326,900 |
Filed: | October 27, 2008 |
Current U.S. Class: | D13/179 |
Current International Class: | 1303 |
Field of Search: | ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719 |
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2004/0226690 | November 2004 | Lee et al. |
2006/0060332 | March 2006 | Wang et al. |
2007/0253202 | November 2007 | Wu et al. |
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