U.S. patent number D605,900 [Application Number D/335,759] was granted by the patent office on 2009-12-15 for thermal insulation sleeve for a tea pot.
This patent grant is currently assigned to Pi-Design AG. Invention is credited to Jorgen Bodum.
United States Patent |
D605,900 |
Bodum |
December 15, 2009 |
Thermal insulation sleeve for a tea pot
Claims
CLAIM The ornamental design for a thermal insulation sleeve for a
tea pot, as shown and described.
Inventors: |
Bodum; Jorgen (Meggen,
CH) |
Assignee: |
Pi-Design AG (Triengen,
CH)
|
Appl.
No.: |
D/335,759 |
Filed: |
April 21, 2009 |
Foreign Application Priority Data
|
|
|
|
|
Oct 27, 2008 [WO] |
|
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DM/070893 |
|
Current U.S.
Class: |
D7/607; D7/387;
D7/624.2 |
Current International
Class: |
0701 |
Field of
Search: |
;D7/619.1,624.2,607,300,387 ;D6/610 ;62/457.1-457.9
;220/737,739,902,903 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Wallace; Terry A
Attorney, Agent or Firm: Sughrue Mion, PLLC
Description
FIG. 1 is a perspective view of the thermal insulation sleeve for a
tea pot;
FIG. 2 is a first side elevation view thereof;
FIG. 3 is a second side elevation view thereof;
FIG. 4 is a third side elevation view thereof;
FIG. 5 is a fourth side elevation view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a perspective view in an open state thereof; and,
FIG. 9 is a perspective view in use thereof.
The broken lines are for illustrative purposes only and form no
part of the claimed design.
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