U.S. patent number D604,727 [Application Number D/310,509] was granted by the patent office on 2009-11-24 for back cover for electronic device.
This patent grant is currently assigned to FIH (Hong Kong) Limited. Invention is credited to Feng Chu, Qiao-Hua Du, Jen-Lung Huang, Chao-Hsun Lin.
United States Patent |
D604,727 |
Chu , et al. |
November 24, 2009 |
Back cover for electronic device
Claims
CLAIM The ornamental design for a back cover for electronic device,
as shown and described.
Inventors: |
Chu; Feng (Shen-zhen,
CN), Du; Qiao-Hua (Shen-zhen, CN), Lin;
Chao-Hsun (Shin-din, TW), Huang; Jen-Lung
(Shin-din, TW) |
Assignee: |
FIH (Hong Kong) Limited
(Kowloon, HK)
|
Appl.
No.: |
D/310,509 |
Filed: |
August 21, 2008 |
Foreign Application Priority Data
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|
|
|
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Jul 18, 2008 [CN] |
|
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2008 3 0301028 |
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Current U.S.
Class: |
D14/248;
D14/341 |
Current International
Class: |
1403 |
Field of
Search: |
;D14/138,137,138R,138AA,138AB,138AC,138AD,138C,138G,147-148,156,191,247-248,341-347,390,399,455-456
;D5/45,53,54,56,57,59,99,60,61,55,58,62,52,51,50,49,48,47,43
;162/114,123 ;428/166 ;D13/154 ;D11/7 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Simmons; Ian
Assistant Examiner: Wright; Carla
Attorney, Agent or Firm: Reiss; Steven M.
Description
FIG. 1 is a perspective view of back cover for electronic device
showing a first embodiment of our design;
FIG. 2 is a front elevational view of the first embodiment of our
design;
FIG. 3 is a left side view of the first embodiment;
FIG. 4 is a perspective view of back cover for electronic device
showing a second embodiment of our design;
FIG. 5 is a front elevational view of the second embodiment of our
design; and,
FIG. 6 is a left side view of the second embodiment.
The broken line showing of the remainder of the electronic device
is for illustrative purposes only and forms no part of the claimed
design.
* * * * *