U.S. patent number D603,349 [Application Number D/301,542] was granted by the patent office on 2009-11-03 for logic module.
This patent grant is currently assigned to Siemens Aktiengesellschaft. Invention is credited to Ai Cheng Liu.
United States Patent |
D603,349 |
Liu |
November 3, 2009 |
Logic module
Claims
CLAIM The ornamental design for a logic module, as shown and
described.
Inventors: |
Liu; Ai Cheng (Nanjing,
CN) |
Assignee: |
Siemens Aktiengesellschaft
(Munich, DE)
|
Appl.
No.: |
D/301,542 |
Filed: |
March 6, 2008 |
Foreign Application Priority Data
|
|
|
|
|
Sep 6, 2007 [CN] |
|
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2007 3 0150491 |
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Current U.S.
Class: |
D13/162.1 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/158,159,160,162,162.1,163,164,177,178,184,199 ;D10/106
;439/660,568 ;361/686,752,600,601,627,641,690,678,605
;307/149,125,113 ;232/4R,1D ;220/324,3.8 ;109/173 ;206/1.5 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Bui; Daniel D
Assistant Examiner: Johannes; Thomas J
Description
The patent or application file contains at least one drawing
executed in color. Copies of this patent or patent application
publication with color drawing(s) will be provided by the Office
upon request and payment of the necessary fee.
FIG. 1 is a top view of the logic module; and,
FIG. 2 is a side view of the logic module.
* * * * *