Housing of a light emitting diode package

Description

FIG. 1 is a perspective view of a housing of a light emitting diode package showing the new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof wherein the broken line showing portion of the LED is for illustrative purpose only and forms no part of the claimed design;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof; and,

FIG. 6 is a top view thereof, the bottom view being a mirror image of the top side view.

The claimed housing of a light emitting diode package includes a pair of leads. Both of the leads extend toward the rear side of the housing through two opposite sides of the housing and are not protruding out of the outer surfaces of the housing. Therefore, the housing is not only suitable for being used in a side view light emitting diode package but a top view light emitting diode package.

Claims

CLAIM The ornamental design for a housing of a light emitting diode package, as shown and described.

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Inventors:	Sheng; Chung-Han (Banciao, TW), Chen; Yi-Wen (Banciao, TW)
Assignee:	Everlight Electronics Co., Ltd. (Taipei, TW)
Appl. No.:	D/306,131
Filed:	April 3, 2008

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Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100 ;313/483,498,500 ;362/555,800

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References Cited [Referenced By]

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U.S. Patent Documents

D528999	September 2006	Cho et al.
D537798	March 2007	Shin et al.
D558156	December 2007	Yoon et al.
D578491	October 2008	Lee et al.
D593515	June 2009	Nakagawa

Foreign Patent Documents

	D1261967		Feb 2006		JP
	D1288463		Dec 2006		JP
	575349		Feb 2004		TW

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Jianq Chyun IP Office