Wafer boat

Description

FIG. 1 is a front view;

FIG. 2 is a partial enlarged perspective view of a bottom along 2--2 of the frontal view shown in FIG. 1;

FIG. 3 is an enlarged bottom view;

FIG. 4 is a rear view;

FIG. 5 is a left side view the right side being a mirror image thereof;

FIG. 6 is a plan view;

FIG. 7 is a bottom view; and,

FIG. 8 is a partial, enlarged view, along 2--2 of a front view shown in FIG. 1 of the wafer boat in use.

Salients are formed on a bottom board of a wafer boat to get into reentrants of a heat insulating cylinder for manufacturing a semiconductor wafer, and stabilize it in a setting condition. The portion shown in solid lines is my claimed design. The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for a wafer boat, as shown and described.

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Inventors:	Sato; Izumi (Oshu, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/309,701
Filed:	September 26, 2008

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Foreign Application Priority Data

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Mar 28, 2008 [JP]			2008-007857

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D25/113,118,136 ;D21/484,500,505 ;52/610 ;118/728,729 ;211/41.18 ;432/241,253,258

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References Cited [Referenced By]

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U.S. Patent Documents

D411176	June 1999	Shimazu
6110285	August 2000	Kitazawa et al.
6163015	December 2000	Moore et al.
6287112	September 2001	Van Voorst Vader et al.
6454865	September 2002	Goodman et al.
6536608	March 2003	Buckley
6780251	August 2004	Tometsuka
6811040	November 2004	Payne et al.
6840767	January 2005	Goodman
7207763	April 2007	Lee
D580894	November 2008	Sato
7455734	November 2008	Yamaguchi et al.
2002/0187023	December 2002	Araki
2007/0157886	July 2007	Elgar et al.
2008/0041820	February 2008	Tong et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Smith, Gambrell & Russell, LLP