Housing for electronics device
Bicket , et al. July 14, 2
U.S. patent number D596,169 [Application Number D/295,197] was granted by the patent office on 2009-07-14 for housing for electronics device. This patent grant is currently assigned to Meraki, Inc.. Invention is credited to John Bicket, Sanjit Biswas, Benjamin Calderon, Morgan Teachworth.
| United States Patent | D596,169 |
| Bicket , et al. | July 14, 2009 |
Housing for electronics device
Claims
CLAIM The ornamental design for housing for electronics device, as shown and described.
| Inventors: | Bicket; John (Mountain View, CA), Biswas; Sanjit (Mountain View, CA), Teachworth; Morgan (Mountain View, CA), Calderon; Benjamin (Mountain View, CA) |
|---|---|
| Assignee: | Meraki, Inc. (San Francisco,
CA) |
| Appl. No.: | D/295,197 |
| Filed: | September 21, 2007 |
| Current U.S. Class: | D14/240 |
| Current International Class: | 1402 |
| Field of Search: | ;D14/356,358,233,240,242,300,348,388,433,155 ;D13/184,137.2,107,108,144 ;360/69 ;379/220.1,220.14,25,93.09,93.15,156,900,338,329 ;381/124 ;607/36 ;307/10.1 ;439/668 |
References Cited [Referenced By]
U.S. Patent Documents
| D432527 | October 2000 | DeLeon |
| D477603 | July 2003 | Chen |
| D484879 | January 2004 | Jones |
| D495665 | September 2004 | Stekelenburg |
| D506996 | July 2005 | Nilsen |
| D543513 | May 2007 | Allen et al. |
| D556678 | December 2007 | Weinstein et al. |
| D577721 | September 2008 | O'Neil |
| D579010 | October 2008 | Tseng |
| D580853 | November 2008 | Ahlgren |
Assistant Examiner: Hanson; Charles D
Attorney, Agent or Firm: Townsend and Townsend and Crew, LLP
Description
The design comprises a housing for electronics device for enclosing electronics, such as circuitry for a network router.
FIG. 1 is a perspective view of a housing for electronics device showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a rear elevational view thereof.
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