Wafer holding member

Description

FIG. 1 is a front elevational view of a wafer holding member showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a top, front and right side perspective view thereof;

FIG. 8 is a bottom, front and left side perspective view thereof; and,

FIG. 9 is a cross-sectional view thereof taken along line 9--9 in FIG. 1.

Claims

CLAIM The ornamental design for a wafer holding member, as shown and described.

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Inventors:	Ogasawara; Ikuo (Nirasaki, JP), Nagasaka; Munetoshi (Nirasaki, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/298,522
Filed:	December 6, 2007

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;118/500,725,729 ;414/217,222.01,416.03

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References Cited [Referenced By]

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U.S. Patent Documents

5643366	July 1997	Somekh et al.
6183183	February 2001	Goodwin et al.
6190114	February 2001	Ogawa et al.
6190460	February 2001	Hwang
6405610	June 2002	Komatsu et al.
D559805	January 2008	Hosaka
2001/0051088	December 2001	Park et al.
2003/0169916	September 2003	Hayashi et al.
2006/0120833	June 2006	Bonora et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.