U.S. patent number D587,087 [Application Number D/295,487] was granted by the patent office on 2009-02-24 for clamping apparatus.
This patent grant is currently assigned to SMC Corporation. Invention is credited to Tsuyoshi Asaba, Kenichi Takeda.
United States Patent |
D587,087 |
Takeda , et al. |
February 24, 2009 |
Clamping apparatus
Claims
CLAIM The ornamental design for a clamping apparatus, as shown.
Inventors: |
Takeda; Kenichi (Tsukubamirai,
JP), Asaba; Tsuyoshi (Tsukubamirai, JP) |
Assignee: |
SMC Corporation (Tokyo,
JP)
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Appl.
No.: |
D/295,487 |
Filed: |
September 28, 2007 |
Foreign Application Priority Data
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Mar 28, 2007 [JP] |
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2007-007850 |
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Current U.S.
Class: |
D8/72 |
Current International
Class: |
0805 |
Field of
Search: |
;D8/71-74,394,396,397,399 ;248/72,689,124.2 ;81/487,427,321
;269/3,6,143,165,240,243 ;29/256,257,276 ;D15/140 ;92/19 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Zarfas; Louis S
Assistant Examiner: Muller; David G
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier
& Neustadt, P.C.
Description
FIG. 1 is a top and left front perspective view of a clamping
apparatus, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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