Groove formed around a semiconductor device on a circuit board

Description

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line 3--3 in FIG. 2.

The broken lines represent unclaimed subject matter.

Claims

CLAIM The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

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Inventors:	Ohsawa; Tetsuya (Osaka, JP), Tani; Emiko (Osaka, JP)
Assignee:	Nitto Denko Corporation (Osaka, JP)
Appl. No.:	D/306,335
Filed:	April 7, 2008

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29240252	Oct 11, 2005	D568836

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Foreign Application Priority Data

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Apr 13, 2005 [JP]			2005-010971
Apr 13, 2005 [JP]			2005-010989

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/250,251,253,254,255,256,265,260,261 ;361/760,748,720 ;336/200

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References Cited [Referenced By]

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U.S. Patent Documents

D319629	September 1991	Hasegawa et al.
5420558	May 1995	Ito et al.
5467252	November 1995	Nomi et al.
5777277	July 1998	Inagawa
5969590	October 1999	Gutierrez
6114937	September 2000	Burghartz et al.
6121552	September 2000	Brosnihan et al.
6486412	November 2002	Kato
7126452	October 2006	Teshima et al.
D568836	May 2008	Ohsawa et al.
2006/0266545	November 2006	Takeuchi et al.
2007/0188287	August 2007	Lien et al.
2007/0205856	September 2007	Matsunaga et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Osha .cndot. Liang LLP