Lead frame for a through-hole light emitting diode device

Description

FIG. 1 is a perspective view of the lead frame for a through-hole light emitting diode device showing our new design.

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevation view thereof; and,

FIG. 7 is a right side elevation view thereof.

The broken lines represent unclaimed subject matter.

Claims

CLAIM The ornamental design for a lead frame for a through-hole light emitting diode device, as shown and described.

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Inventors:	Yen; Jui-Kang (Taipei, TW), Chen; Yung-Wei (Taichung, TW)
Assignee:	Semi-Photonics Co., Ltd. (Chu-nan, TW)
Appl. No.:	D/249,578
Filed:	October 12, 2006

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Current U.S. Class:	D13/180
Current International Class:	1303
Field of Search:	;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100 ;313/483,498,500 ;362/555,800

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References Cited [Referenced By]

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U.S. Patent Documents

5977626	November 1999	Wang et al.
6559379	May 2003	Solanki et al.
6569764	May 2003	Hirashima et al.
6891256	May 2005	Joshi et al.
6919625	July 2005	O'Shea et al.
6943433	September 2005	Kamada
6999318	February 2006	Newby
D520965	May 2006	Omata
D532383	November 2006	Nagai et al.
D536309	February 2007	Muguruma et al.
7211882	May 2007	Wang et al.
7321161	January 2008	Teixeira et al.
2003/0116769	June 2003	Song et al.
2005/0127483	June 2005	Joshi et al.
2005/0269587	December 2005	Loh et al.
2006/0157726	July 2006	Loh et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Patterson & Sheridan, LLP