Upper heat insulating cylinder for manufacturing semiconductor wafers

Description

FIG. 1 is a perspective view of the design for an upper heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is another top view thereof which shows sectional line 9--9;

FIG. 9 is a sectional view thereof along line 9--9 of FIG. 8; and,

FIG. 10 shows an upper heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention in use wherein the broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for an upper heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

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Inventors:	Sato; Izumi (Tokyo, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/272,821
Filed:	February 20, 2007

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;118/715 ;206/454,711 ;211/41.18 ;432/253

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References Cited [Referenced By]

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U.S. Patent Documents

5534074	July 1996	Koons
D404375	January 1999	Shimazu
D405428	February 1999	Ishii
6033215	March 2000	Ohsawa
6171400	January 2001	Wingo
2002/0092815	July 2002	Kim et al.
2004/0069732	April 2004	Huang et al.
2005/0145584	July 2005	Buckley et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Smith, Gambrell & Russell, LLP