U.S. patent number D579,877 [Application Number D/281,833] was granted by the patent office on 2008-11-04 for microcontroller enclosure housing.
This patent grant is currently assigned to Sauer-Danfoss Inc.. Invention is credited to Joel R. Carpenter, Cezary Pluska.
United States Patent |
D579,877 |
Carpenter , et al. |
November 4, 2008 |
Microcontroller enclosure housing
Claims
CLAIM We claim the ornamental design for a microcontroller
enclosure housing, as shown and described.
Inventors: |
Carpenter; Joel R. (Zimmerman,
MN), Pluska; Cezary (Kiel, DE) |
Assignee: |
Sauer-Danfoss Inc. (Ames,
IA)
|
Appl.
No.: |
D/281,833 |
Filed: |
July 3, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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29200217 |
Oct 23, 2007 |
D553571 |
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Current U.S.
Class: |
D13/147 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/133,146,147,154,184,199
;439/135,180,259,278,290,291,292,295,483,527,529,533,540.1,569,752.5,892,894 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Bui; Daniel D
Description
FIG. 1 is a front, top and right side perspective view of a
microcontroller enclosure housing showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a rear elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken line portion of the figure drawings is included to show
unclaimed subject matter only and forms no part of the claimed
design.
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