Chip

Description

FIG. 1 is a perspective view of a new chip design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a chip, as shown and described.

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Inventors:	Lei; Leo (Guangzhou, CN), Wang; Raymond (Guangzhou, CN)
Assignee:	Podium Photonics (Guangzhou) Ltd. (Guangzhou, Guangdong Province, CN)
Appl. No.:	D/304,268
Filed:	February 27, 2008

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Foreign Application Priority Data

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Aug 27, 2007 [CN]			2007 3 0153942

Current U.S. Class:	D14/435; D13/180; D14/437
Current International Class:	1402
Field of Search:	;D14/435-438 ;D13/180,182,162 ;257/79,744,10,414,415,368,690,749,461,13,21,63,19,88,200,201,212,187,288,918,776 ;435/6 ;445/50 ;427/569 ;428/408,367 ;204/450 ;313/495,311,309 ;324/464,207.2 ;338/195,20 ;524/233 ;315/502 ;361/751 ;977/742,938

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References Cited [Referenced By]

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Primary Examiner: Tung; Melanie
Assistant Examiner: Lee; Susan Moon
Attorney, Agent or Firm: Rader, Fishman & Grauer, PLLC