U.S. patent number D574,792 [Application Number D/272,820] was granted by the patent office on 2008-08-12 for lower heat insulating cylinder for manufacturing semiconductor wafers.
This patent grant is currently assigned to Tokyo Electron Limited. Invention is credited to Izumi Sato.
United States Patent |
D574,792 |
Sato |
August 12, 2008 |
Lower heat insulating cylinder for manufacturing semiconductor
wafers
Claims
CLAIM The ornamental design for a lower heat insulating cylinder
for manufacturing semiconductor wafers, as shown and described.
Inventors: |
Sato; Izumi (Tokyo,
JP) |
Assignee: |
Tokyo Electron Limited (Tokyo,
JP)
|
Appl.
No.: |
D/272,820 |
Filed: |
February 20, 2007 |
Foreign Application Priority Data
|
|
|
|
|
Aug 23, 2006 [JP] |
|
|
2006-022201 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 ;118/715
;206/454,711 ;211/41.18 ;432/253 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Copending U.S. Appl. No. 29/272,821, filed Feb. 20, 2007, "Upper
Heat Insulating Cylinder for Manufacturing Semiconductor Wafers".
cited by other.
|
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Smith, Gambrell & Russell,
LLP
Description
FIG. 1 is a perspective view of the design for a lower heat
insulating cylinder for manufacturing semiconductor wafers in
accordance with the invention;
FIG. 2 is a front view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is another top view thereof which shows sectional line
9--9;
FIG. 9 is a sectional view thereof along line 9--9 of FIG. 8;
and,
FIG. 10 shows a lower heat insulating cylinder for manufacturing
semiconductor wafers in accordance with the invention in use
wherein the broken line showing of the environment is for
illustrative purpose only and forms no part of the claimed
design.
* * * * *