LED package

Lee July 22, 2

Patent Grant D573551

U.S. patent number D573,551 [Application Number D/274,670] was granted by the patent office on 2008-07-22 for led package. This patent grant is currently assigned to LG Innotek Co., Ltd.. Invention is credited to Kwang Cheol Lee.


United States Patent D573,551
Lee July 22, 2008

LED package

Claims

CLAIM The ornamental design for an LED package, as shown and describe.
Inventors: Lee; Kwang Cheol (Gwangju, KR)
Assignee: LG Innotek Co., Ltd. (Seoul, KR)
Appl. No.: D/274,670
Filed: May 14, 2007

Foreign Application Priority Data

Nov 14, 2006 [KR] 30-2006-0045260
Current U.S. Class: D13/180
Current International Class: 1303
Field of Search: ;D13/180 ;D26/2 ;257/79,80,81,88,89,95,98,99,100 ;313/483,498,500 ;362/555,800

References Cited [Referenced By]

U.S. Patent Documents
6495861 December 2002 Ishinaga
D517027 March 2006 Suenaga
D524260 July 2006 Ishizaka et al.
7153000 December 2006 Park et al.
2003/0098459 May 2003 Horiuchi et al.
2004/0041222 March 2004 Loh
2004/0201987 October 2004 Omata
2004/0207059 October 2004 Hong
2006/0220049 October 2006 Flaherty et al.
2007/0194336 August 2007 Shin et al.
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Birch, Stewart, Kolasch & Birch, LLP

Description



FIG. 1 is a perspective view of the LED package showing my new design;

FIG. 2 is a front side view thereof, the rear view being a mirror image thereof;

FIG. 3 is a left side view thereof, the right side view being a mirror image thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a section view taken along line 6--6 in FIG. 4.

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