Heat dissipation device

Description

FIG. 1 is a perspective view of a heat dissipation device showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side, elevational view thereof;

FIG. 5 is a right-side, elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view thereof, showing a cooling fan being mounted to the heat dissipation device, wherein the cooling fan is shown in broken lines for illustrative environmental purposes only and forms no part of the claimed design.

Claims

CLAIM The ornamental design for a heat dissipation device, as shown and described.

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Inventors:	Xu; Hong-Bo (Shenzhen, CN)
Assignee:	Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien, TW)
Appl. No.:	D/284,195
Filed:	September 3, 2007

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Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719

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References Cited [Referenced By]

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U.S. Patent Documents

6860321	March 2005	Ji-Hai et al.
6942020	September 2005	Chen et al.
7068512	June 2006	Lee et al.
2005/0056400	March 2005	Chen et al.
2005/0247437	November 2005	Ying et al.
2006/0070721	April 2006	Chen
2006/0082972	April 2006	Kim
2006/0102324	May 2006	Mok et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Niranjan; Frank R.