U.S. patent number D573,064 [Application Number D/281,198] was granted by the patent office on 2008-07-15 for automobile.
This patent grant is currently assigned to Honda Motor Co., Ltd.. Invention is credited to Daisuke Sawai.
United States Patent |
D573,064 |
Sawai |
July 15, 2008 |
Automobile
Claims
CLAIM What is claimed is; the ornamental design for, an automobile,
as shown and described.
Inventors: |
Sawai; Daisuke (Saitama,
JP) |
Assignee: |
Honda Motor Co., Ltd. (Tokyo,
JP)
|
Appl.
No.: |
D/281,198 |
Filed: |
June 18, 2007 |
Foreign Application Priority Data
|
|
|
|
|
Dec 22, 2006 [JP] |
|
|
2006-035219 |
|
Current U.S.
Class: |
D12/92 |
Current International
Class: |
1208 |
Field of
Search: |
;D12/90-92,86,88
;D21/424,433 ;296/181.1,181.5 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Japanese Office Action dated Jun. 22, 2007, Application No.
2006-35218. cited by other.
|
Primary Examiner: Brown; Melody N.
Attorney, Agent or Firm: Westerman, Hattori, Daniels &
Adrian, LLP.
Description
FIG. 1 is a front and right side perspective view of an automobile,
showing our new design;
FIG. 2 is a right and rear perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a left side elevation view thereof the right side being a
mirror image of that shown;
FIG. 5 is a rear side elevation view thereof; and,
FIG. 6 is a top plan view thereof.
The rear elevation view is a mirror image of the front elevation
view.
The broken lines are for illustrative purposes only and form no
part of the claimed design.
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