U.S. patent number D572,118 [Application Number D/288,140] was granted by the patent office on 2008-07-01 for retaining ring for hole.
This patent grant is currently assigned to SMC Corporation. Invention is credited to Shioto Tokumoto.
United States Patent |
D572,118 |
Tokumoto |
July 1, 2008 |
Retaining ring for hole
Claims
CLAIM The ornamental design for a retaining ring for hole, as shown
and described.
Inventors: |
Tokumoto; Shioto (Tsukubamirai,
JP) |
Assignee: |
SMC Corporation (Chiyoda-ku,
Tokyo, JP)
|
Appl.
No.: |
D/288,140 |
Filed: |
May 31, 2007 |
Foreign Application Priority Data
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|
|
|
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Dec 5, 2006 [JP] |
|
|
2006-033583 |
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Current U.S.
Class: |
D8/354 |
Current International
Class: |
0805 |
Field of
Search: |
;D8/354
;411/517-518,520-522 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Baynham; Holly H
Attorney, Agent or Firm: Ganjian; Peter
Description
FIG. 1 shows a front view of a retaining ring for hole showing my
new design;
FIG. 2 shows a top view thereof;
FIG. 3 shows a bottom view thereof;
FIG. 4 shows a right side view thereof;
FIG. 5 shows a perspective view thereof; and,
FIG. 6 is a reduced scale perspective view thereof shown with a
cylinder tube.
The broken line shown in FIGS. 6 is included for the purpose of
illustrating environment and form no part of the claimed
design.
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