Electronic component cooling apparatus

Description

FIG. 1 is a front elevation view of an electronic component cooling apparatus showing our new design;

FIG. 2 is a rear elevation view of the cooling apparatus;

FIG. 3 is a right side elevation view of the cooling apparatus;

FIG. 4 is a left side elevation view of the cooling apparatus;

FIG. 5 is a top plan view of the cooling apparatus;

FIG. 6 is a bottom plan view of the cooling apparatus;

FIG. 7 is a top plan reference view of the cooling apparatus;

FIG. 8 is a longitudinal cross sectional view of the cooling apparatus taken along line 8--8 in FIG. 7; and,

FIG. 9 is a perspective view of the cooling apparatus.

Claims

CLAIM The ornamental design for an electronic component cooling apparatus, as shown and described.

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Inventors:	Watanabe; Michinori (Nagano, JP), Ogawara; Toshiki (Nagano, JP), Maruyama; Haruhisa (Nagano, JP)
Assignee:	Sanyo Denki Co., Ltd. (Tokyo, JP)
Appl. No.:	D/249,886
Filed:	October 25, 2006

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Related U.S. Patent Documents

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	Application Number	Filing Date	Patent Number	Issue Date
	29216926	Nov 10, 2004	D541229

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Foreign Application Priority Data

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May 13, 2004 [JP]			2004-014192
May 13, 2004 [JP]			2004-014193
May 13, 2004 [JP]			2004-014194
May 13, 2004 [JP]			2004-014195

Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;D23/370,379 ;165/80.3,121,122,146 ;361/274.3,695,697,700,702

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References Cited [Referenced By]

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U.S. Patent Documents

5785116	July 1998	Wagner
5883449	March 1999	Mehta et al.
5975194	November 1999	Wagner
6152214	November 2000	Wagner
6419007	July 2002	Ogawara et al.
6480383	November 2002	Kodaira et al.
6698499	March 2004	Wagner
D501450	February 2005	Watanabe et al.
D516526	March 2006	Watanabe et al.
D541229	April 2007	Watanabe et al.

Foreign Patent Documents

	1138843		Feb 2002		JP
	1157130		Sep 2002		JP
	1186376		Aug 2003		JP
	1186377		Aug 2003		JP
	1222196		Sep 2004		JP
	1222480		Sep 2004		JP

Primary Examiner: Lichtenstein; Lisa
Attorney, Agent or Firm: Rankin, Hill & Clark LLP