Electronic component cooling apparatus Patent Grant Watanabe , et al. February 1, 2 [Sanyo Denki Co., Ltd.]

Electronic component cooling apparatus

Watanabe , et al. February 1, 2

Patent Grant D501450

U.S. patent number D501,450 [Application Number D/183,270] was granted by the patent office on 2005-02-01 for electronic component cooling apparatus. This patent grant is currently assigned to Sanyo Denki Co., Ltd.. Invention is credited to Masayuki Iijima, Haruhisa Maruyama, Toshiki Ogawara, Michinori Watanabe.

United States Patent	D501,450
Watanabe , et al.	February 1, 2005

Electronic component cooling apparatus

Claims

The ornamental design for a electronic component cooling apparatus, as shown and described.

Inventors:	Watanabe; Michinori (Nagano, JP), Ogawara; Toshiki (Nagano, JP), Iijima; Masayuki (Nagano, JP), Maruyama; Haruhisa (Nagano, JP)
Assignee:	Sanyo Denki Co., Ltd. (Tokyo, JP)
Appl. No.:	D/183,270
Filed:	June 10, 2003

Current U.S. Class:	D13/179
Current International Class:	1303
Field of Search:	;D13/179 ;165/80.3,104.33,121,122,146,185 ;257/697,706,707,712,718,719,720,721,722 ;361/695,697,699,702,704,709,514

References Cited [Referenced By]

U.S. Patent Documents


6449151	September 2002	Chen
6449152	September 2002	Lin
6466443	October 2002	Chen
6507491	January 2003	Chen
6525941	February 2003	Lai
6560111	May 2003	Lo
D478876	August 2003	Tan et al.

Primary Examiner: Hyder; Philip S.
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Rankin, Hill, Porter & Clark LLP

Description

FIG. 1 is a front view of an electronic component cooling apparatus according to our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a cross-sectional view along line 8--8 of FIG. 5.

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