U.S. patent number D569,350 [Application Number D/283,292] was granted by the patent office on 2008-05-20 for solid state relay.
This patent grant is currently assigned to Omron Corporation. Invention is credited to Thuyoshi Fujino, Shoichi Konagata.
United States Patent |
D569,350 |
Konagata , et al. |
May 20, 2008 |
Solid state relay
Claims
CLAIM The ornamental designs for a solid state relay, as shown and
described.
Inventors: |
Konagata; Shoichi (Ureshino,
JP), Fujino; Thuyoshi (Takeo, JP) |
Assignee: |
Omron Corporation (Kyoto-shi,
JP)
|
Appl.
No.: |
D/283,292 |
Filed: |
August 9, 2007 |
Foreign Application Priority Data
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|
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Feb 15, 2007 [JP] |
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2007-003585 |
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Current U.S.
Class: |
D13/159 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/159 ;335/132,202
;361/94 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Bui; Daniel
Assistant Examiner: Johannes; Thomas J
Attorney, Agent or Firm: Harness, Dickey & Pierce,
P.L.C.
Description
FIG. 1 is a front perspective view of a solid state relay showing
our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and
FIG. 6 is a right side elevational view thereof.
FIG. 7 is a left side elevational view thereof.
FIG. 8 is an enlarged perspective view in the box labeled 8 of FIG.
1 thereof; and,
FIG. 9 is an enlarged front elevational view in the box labeled 9
of FIG. 2 thereof.
The broken lines are shown in the views for illustrative purposes
only, and form no part of the claimed design.
* * * * *