Groove formed around a semiconductor device on a circuit board

Description

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1; and,

FIG. 3 is a sectional view taken along line 3--3 in FIG. 2.

The broken lines represent unclaimed subject matter.

Claims

CLAIM The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

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Inventors:	Ohsawa; Tetsuya (Osaka, JP), Tani; Emiko (Osaka, JP)
Assignee:	Nitto Denko Corporation (Osaka, JP)
Appl. No.:	D/240,252
Filed:	October 11, 2005

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Foreign Application Priority Data

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Apr 13, 2005 [JP]			2005-010971
Apr 13, 2005 [JP]			2005-010989

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/250,251,253,254,255,256,265,260,261 ;361/760,748,720 ;336/200

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References Cited [Referenced By]

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U.S. Patent Documents

D319629	September 1991	Hasegawa et al.
5420558	May 1995	Ito et al.
5467252	November 1995	Nomi et al.
5777277	July 1998	Inagawa
5969590	October 1999	Gutierrez
6114937	September 2000	Burghartz et al.
6121552	September 2000	Brosnihan et al.
6486412	November 2002	Kato
7126452	October 2006	Teshima et al.
2006/0266545	November 2006	Takeuchi et al.
2007/0188287	August 2007	Lien et al.
2007/0205856	September 2007	Matsunaga et al.

Foreign Patent Documents

	11-8275		Jan 1999		JP

Other References

Offica Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages). cited by other . English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page). cited by other . English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages). cited by other.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Osha Liang LLP