U.S. patent number D564,462 [Application Number D/260,830] was granted by the patent office on 2008-03-18 for rf electrode for a process tube of semiconductor manufacturing apparatus.
This patent grant is currently assigned to Tokyo Electron Limited. Invention is credited to Katsutoshi Ishii, Hiroyuki Matsuura.
United States Patent |
D564,462 |
Ishii , et al. |
March 18, 2008 |
RF electrode for a process tube of semiconductor manufacturing
apparatus
Claims
CLAIM The ornamental design for a RF electrode for a process tube
of semiconductor manufacturing apparatus, as shown and described.
Inventors: |
Ishii; Katsutoshi (Tokyo,
JP), Matsuura; Hiroyuki (Tokyo, JP) |
Assignee: |
Tokyo Electron Limited
(Tokyo-To, JP)
|
Appl.
No.: |
D/260,830 |
Filed: |
June 2, 2006 |
Foreign Application Priority Data
|
|
|
|
|
Dec 27, 2005 [JP] |
|
|
2005-038333 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/199,182,181,180,165,166 ;D24/187,170,144,233
;205/98,256,272,284,292,336,375,399,400,528,576,588,708,730,143,148,732,733,737,738,739
;385/40 ;314/34 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Spear; Robert M.
Assistant Examiner: Dworzecka; Anna K
Attorney, Agent or Firm: Smith, Gambrell & Russell,
LLP
Description
FIG. 1 is a front view of a RF electrode for a process tube of
semiconductor manufacturing apparatus showing our new design;
FIG. 2 is a back view thereof;
FIG. 3 is a plan view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is an enlarged sectional view taken along with line VI--VI
of FIG. 1;
FIG. 7 is an enlarged sectional view taken along with line VII--VII
of FIG. 1;
FIG. 8 is a perspective view as seen from the front side
thereof;
FIG. 9 is a reference drawing showing a state of use of a RF
electrode; and,
FIG. 10 is a reference drawing showing a state of use of a RF
electrode.
* * * * *