U.S. patent number D563,167 [Application Number D/241,055] was granted by the patent office on 2008-03-04 for round lid with utensil recess. This patent grant is currently assigned to Clear Lam Packaging, Inc.. Invention is credited to George A. Golota, Craig Snedden.
United States Patent | D563,167 |
Snedden , et al. | March 4, 2008 |
Inventors: | Snedden; Craig (Culver City, CA), Golota; George A. (Glenview, IL) |
---|---|
Assignee: | Clear Lam Packaging, Inc. (Elk
Grove Village, IL) |
Appl. No.: | D/241,055 |
Filed: | October 21, 2005 |
Current U.S. Class: | D7/505; D9/716 |
Current International Class: | 0701 |
Field of Search: | ;D7/300,305,309,310,329.1,387,399,400,401.2,500,510,505-507,511,523,538,542,543,550.1,548,553.3,553.6,554.2,584,598,601,602,605,619.1,620,622,643,647,667 ;D9/414,418,423-425,428-431,434-436,715-717,719,737,744-745,447,454 ;D23/209 ;62/457.6 ;150/901 ;99/275,279,283,303 ;206/207,217,216,223,502,507,514,541 ;210/348 ;220/4.01 ;229/400,403,404,406,906.1 |
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