U.S. patent number D562,309 [Application Number D/268,228] was granted by the patent office on 2008-02-19 for headset.
This patent grant is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Jung-Hyun Choi, Sang-Min Hyun, Chang-Soo Lee.
United States Patent |
D562,309 |
Choi , et al. |
February 19, 2008 |
Headset
Claims
CLAIM The ornamental design for a headset, as shown and described.
Inventors: |
Choi; Jung-Hyun (Seoul,
KR), Hyun; Sang-Min (Seoul, KR), Lee;
Chang-Soo (Incheon, KR) |
Assignee: |
Samsung Electronics Co., Ltd.
(Suwon-Si, KR)
|
Appl.
No.: |
D/268,228 |
Filed: |
November 2, 2006 |
Foreign Application Priority Data
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|
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May 4, 2006 [KR] |
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30-2006-0016795 |
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Current U.S.
Class: |
D14/223 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/188,192,205-206,223
;D24/174 ;D3/201,206,218 ;D6/632 ;206/1.5,250,256,257,320,387.12
;381/182,370,376-379,374,380-381 ;181/129-130 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula A.
Attorney, Agent or Firm: Staas & Halsey LLP
Description
FIG. 1 is a perspective view of a headset according to our new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a perspective view of the headset according to our new
design in a state in which a microphone of the headset is slided to
be used; and,
FIG. 9 is a top plan view of the headset according to our new
design in a state in which a receiver of the headset is folded.
The surface(s) or portion(s) of the article not shown in the
drawing or described in the specification form(s) no part of the
claimed design.
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