Headphones
Lee January 15, 2
U.S. patent number D559,831 [Application Number D/280,166] was granted by the patent office on 2008-01-15 for headphones. This patent grant is currently assigned to Coby Electronics Corporation. Invention is credited to Johann Lee.
| United States Patent | D559,831 |
| Lee | January 15, 2008 |
Headphones
Claims
CLAIM The ornamental design of headphones, as shown and described:
| Inventors: | Lee; Johann (Maspeth, NY) |
|---|---|
| Assignee: | Coby Electronics Corporation
(Maspeth, NY) |
| Appl. No.: | D/280,166 |
| Filed: | May 18, 2007 |
Related U.S. Patent Documents
| Application Number | Filing Date | Patent Number | Issue Date | ||
|---|---|---|---|---|---|
| 29245292 | Dec 22, 2005 | ||||
| Current U.S. Class: | D14/205 |
| Current International Class: | 1401 |
| Field of Search: | ;D14/156,192,205,206,223,229,215 ;D29/108,112,122 ;2/208,209,209.13 ;181/129,130 ;379/430,431 ;381/309,370,371,378,379,380,381,385 |
References Cited [Referenced By]
U.S. Patent Documents
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| D237307 | October 1975 | Miyamoto et al. |
| D342947 | January 1994 | Totsuka |
| D347434 | May 1994 | Yamatogi |
| D352036 | November 1994 | Sekita |
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| 5673438 | October 1997 | Lambert |
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| D439574 | March 2001 | Katayama |
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| D453015 | January 2002 | Yuyama |
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| D504672 | May 2005 | Hirano |
| D508908 | August 2005 | Chueh |
| D525614 | July 2006 | Lee |
| D534156 | December 2006 | Obata |
| D541257 | April 2007 | Thursfield |
Attorney, Agent or Firm: Mayer Brown LLP
Description
A portion of this patent document contains material which is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent files or records, but otherwise reserves all copyrights whatsoever.
FIG. 1 is a perspective view of headphones according to my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a left side elevation view of a portion of the headphones;
FIG. 5 is a right side elevation view of a portion of the headphones;
FIG. 6 is a back elevation view thereof; and,
FIG. 7 is a bottom plan view thereof.
The Broken line showings throughout the views are for illustrative purposes only and form no part of the claimed design.
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