U.S. patent number D559,806 [Application Number D/242,545] was granted by the patent office on 2008-01-15 for pair of stage arms for a semiconductor wafer delivery apparatus.
This patent grant is currently assigned to Tokyo Electron Limited. Invention is credited to Hiroki Hosaka.
United States Patent |
D559,806 |
Hosaka |
January 15, 2008 |
Pair of stage arms for a semiconductor wafer delivery apparatus
Claims
CLAIM The ornamental design for a pair of stage arms for a
semiconductor wafer delivery apparatus, as shown and described.
Inventors: |
Hosaka; Hiroki (Nirasaki,
JP) |
Assignee: |
Tokyo Electron Limited (Tokyo,
JP)
|
Appl.
No.: |
D/242,545 |
Filed: |
November 14, 2005 |
Foreign Application Priority Data
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|
|
|
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Aug 12, 2005 [JP] |
|
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2005-023559 |
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Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182 ;134/110
;396/611 ;414/331.15,411,416.03 ;700/213 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier
& Neustadt, P.C.
Description
FIG. 1 is a top plan view of a pair of stage arms for a
semiconductor wafer delivery apparatus showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a cross-sectional view thereof taken along line 4--4 in
FIG. 1;
FIG. 5 is a cross-sectional view thereof taken along line 5--5 in
FIG. 4; and,
FIG. 6 is a perspective view thereof in use.
The broken line showing represents unclaimed subject matter.
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