Pair of stage arms for a semiconductor wafer delivery apparatus

Description

FIG. 1 is a top plan view of a pair of stage arms for a semiconductor wafer delivery apparatus showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a cross-sectional view thereof taken along line 4--4 in FIG. 1;

FIG. 5 is a cross-sectional view thereof taken along line 5--5 in FIG. 4; and,

FIG. 6 is a perspective view thereof in use.

The broken line showing represents unclaimed subject matter.

Claims

CLAIM The ornamental design for a pair of stage arms for a semiconductor wafer delivery apparatus, as shown and described.

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Inventors:	Hosaka; Hiroki (Nirasaki, JP)
Assignee:	Tokyo Electron Limited (Tokyo, JP)
Appl. No.:	D/242,545
Filed:	November 14, 2005

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Foreign Application Priority Data

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Aug 12, 2005 [JP]			2005-023559

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;134/110 ;396/611 ;414/331.15,411,416.03 ;700/213

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References Cited [Referenced By]

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U.S. Patent Documents

5636960	June 1997	Hiroki et al.
5740059	April 1998	Hirata et al.
5772386	June 1998	Mages et al.
5826129	October 1998	Hasebe et al.
6132160	October 2000	Iwai
6234738	May 2001	Kimata et al.
6811370	November 2004	Buermann
6846149	January 2005	Savage et al.
7033126	April 2006	Van Den Berg
2002/0044860	April 2002	Hayashi et al.
2002/0182040	December 2002	Kimura et al.
2002/0197138	December 2002	Cho et al.
2003/0133776	July 2003	Lee
2004/0265100	December 2004	Ohkawara et al.
2005/0220581	October 2005	Chuang et al.
2007/0031222	February 2007	Hosaka et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.