U.S. patent number D556,204 [Application Number D/259,825] was granted by the patent office on 2007-11-27 for filler panel with integrated dust cover. This patent grant is currently assigned to Sun Microsystems, Inc.. Invention is credited to Christopher H. Frank, Lisa Marie Surowiec, Andrew Tosh.
United States Patent | D556,204 |
Tosh , et al. | November 27, 2007 |
Inventors: | Tosh; Andrew (Maynard, MA), Surowiec; Lisa Marie (Beverly, MA), Frank; Christopher H. (San Jose, CA) |
---|---|
Assignee: | Sun Microsystems, Inc. (Santa
Clara, CA) |
Appl. No.: | D/259,825 |
Filed: | May 16, 2006 |
Current U.S. Class: | D14/439 |
Current International Class: | 1402 |
Field of Search: | ;D14/363,367,432-439,489 ;D13/146,147,120,133,199 ;312/223.1,223.2 ;439/159,160,433,630,65,295,441,660,862,152,607-610,131,299,300,345,372,928.1 ;361/685,727 ;200/51.09 |
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