Interphone

Miyamoto , et al. October 23, 2

Patent Grant D553607

U.S. patent number D553,607 [Application Number D/253,851] was granted by the patent office on 2007-10-23 for interphone. This patent grant is currently assigned to Aiphone Co., Ltd.. Invention is credited to Toshio Hotta, Shouheii Miyamoto.


United States Patent D553,607
Miyamoto ,   et al. October 23, 2007

Interphone

Claims

CLAIM The ornamental design for an interphone, as shown and described.
Inventors: Miyamoto; Shouheii (Nagoya, JP), Hotta; Toshio (Tokai, JP)
Assignee: Aiphone Co., Ltd. (Nagoya-Shi, JP)
Appl. No.: D/253,851
Filed: February 14, 2006

Current U.S. Class: D14/159; D14/142; D14/146
Current International Class: 1401
Field of Search: ;D25/155,158-159,162,217,240,299,142,146 ;D10/104,106 ;358/85-86,108 ;340/310.11,538 ;348/156,164,14.04,102.06 ;379/53-54,103-105,171 ;455/4-6

References Cited [Referenced By]

U.S. Patent Documents
D283130 March 1986 Boenning
D289754 May 1987 Koob
4843461 June 1989 Tatsumi et al.
D394653 May 1998 Kato et al.
D394656 May 1998 Kato et al.
D466882 December 2002 Matsui et al.
D480702 October 2003 Yoshida et al.
D488158 April 2004 Chen et al.
Primary Examiner: Bondade; Nanda
Attorney, Agent or Firm: Burr & Brown

Description



FIG. 1 is front perspective view of an interphone illustrating our new design;

FIG. 2 a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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