U.S. patent number D553,599 [Application Number D/257,718] was granted by the patent office on 2007-10-23 for mobile phone. This patent grant is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Beom-Ku Han, Chang-Hwan Hwang, Yang-Jic Lee.
United States Patent | D553,599 |
Lee , et al. | October 23, 2007 |
Inventors: | Lee; Yang-Jic (Seoul, KR), Han; Beom-Ku (Seoul, KR), Hwang; Chang-Hwan (Goyang-si, KR) |
---|---|
Assignee: | Samsung Electronics Co., Ltd.
(KR) |
Appl. No.: | D/257,718 |
Filed: | April 10, 2006 |
Feb 9, 2006 [KR] | 30-2006-0004873 | |||
Current U.S. Class: | D14/138AC; D14/138AD |
Current International Class: | 1403 |
Field of Search: | ;D14/137,138,147,218,341-347,496 ;455/990.3,556.1,556.2,575.1,575.3,575.4 ;379/433.01-433.13 ;361/814 ;348/14.02 |
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