Contact of board to board connector

Peng , et al. October 16, 2

Patent Grant D553086

U.S. patent number D553,086 [Application Number D/266,615] was granted by the patent office on 2007-10-16 for contact of board to board connector. This patent grant is currently assigned to Cheng Uei Precision Industry Co., Ltd.. Invention is credited to Shin-da Chen, Yung-chi Peng.


United States Patent D553,086
Peng ,   et al. October 16, 2007

Contact of board to board connector

Claims

CLAIM The ornamental design for a contact of board to board connector, as shown and described.
Inventors: Peng; Yung-chi (Tu-Cheng, TW), Chen; Shin-da (Tu-Cheng, TW)
Assignee: Cheng Uei Precision Industry Co., Ltd. (Taipei Hsien, TW)
Appl. No.: D/266,615
Filed: September 26, 2006

Current U.S. Class: D13/133; D13/154
Current International Class: 1303
Field of Search: ;D13/133,146,154,184,199 ;439/397,401,404,834,845,849-852,884-885,887

References Cited [Referenced By]

U.S. Patent Documents
5110304 May 1992 Kjeldahl
5738532 April 1998 Takano et al.
6923671 August 2005 Uezono
D514522 February 2006 Chiang et al.
D516524 March 2006 Su
2003/0216086 November 2003 Billman et al.
2004/0048523 March 2004 Huang et al.
Primary Examiner: Bui; Daniel
Attorney, Agent or Firm: Rosenberg, Klein & Lee

Description



FIG. 1 is a perspective view of a contact of board to board connector showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

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