Flat blister package

Hanji July 10, 2

Patent Grant D546182

U.S. patent number D546,182 [Application Number D/266,810] was granted by the patent office on 2007-07-10 for flat blister package. This patent grant is currently assigned to Daido Metal Co., Ltd.. Invention is credited to Seigo Hanji.


United States Patent D546,182
Hanji July 10, 2007

Flat blister package

Claims

CLAIM The ornamental design for a flat blister package, as shown and described.
Inventors: Hanji; Seigo (Nagoya, JP)
Assignee: Daido Metal Co., Ltd. (Nagoya, JP)
Appl. No.: D/266,810
Filed: September 28, 2006

Current U.S. Class: D9/457; D9/415
Current International Class: 0903
Field of Search: ;D9/701,627,628,625,624,621,622,623,457,456,441,434,415,414,432 ;D5/99,7,60,58,4,12 ;D21/376 ;D20/25 ;428/187 ;40/642.01,538,124.1,321,360,299.01 ;283/81,56 ;273/292 ;223/85 ;206/767,45.28,449,300,440

References Cited [Referenced By]

U.S. Patent Documents
D16217 September 1885 Levy
D40414 December 1909 Valentine
D42007 December 1911 Averns
D95070 April 1935 Rivard
2055606 September 1936 Klipfel
D117431 October 1939 Kaufman
D216934 March 1970 Hicks
D218880 October 1970 Conesa
D253517 November 1979 Grodin
D259102 May 1981 Grodin
D284450 July 1986 Suzuki et al.
D467171 December 2002 Hirokawa et al.
D468198 January 2003 Nakazawa et al.
7185761 March 2007 Molina et al.
2005/0230961 October 2005 Walley
Primary Examiner: Spear; Robert M.
Assistant Examiner: Hattan; Susan Bennett
Attorney, Agent or Firm: Seyfarth Shaw LLP

Description



FIG. 1 is a perspective view of a flat blister package;

FIG. 2 is a front view of the flat blister package; and,

FIG. 3 is a rear elevational view of the flat blister package.

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