U.S. patent number D539,645 [Application Number D/217,197] was granted by the patent office on 2007-04-03 for computer motherboard packaging box.
This patent grant is currently assigned to Hon Hai Precision Ind. Co., Ltd. Invention is credited to Jing-Qun Chen, Chun-Chi Liang, Yun-Dong Xu.
United States Patent |
D539,645 |
Chen , et al. |
April 3, 2007 |
Computer motherboard packaging box
Claims
CLAIM The ornamental design for a computer motherboard packaging
box, as shown and described.
Inventors: |
Chen; Jing-Qun (Shenzhen,
CN), Liang; Chun-Chi (Tu-Chen, TW), Xu;
Yun-Dong (Shenzhen, CN) |
Assignee: |
Hon Hai Precision Ind. Co., Ltd
(Taipei Hsien, TW)
|
Appl.
No.: |
D/217,197 |
Filed: |
November 15, 2004 |
Foreign Application Priority Data
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Jun 28, 2004 [CN] |
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2004300438352 |
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Current U.S.
Class: |
D9/432 |
Current International
Class: |
0903 |
Field of
Search: |
;D9/414,430-432,715,721
;229/116.1,116.5,87.19,100,923,124,126,128 ;206/459.5,438,570,575
;220/9.1-9.3,780 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Reid; Stella
Assistant Examiner: Goodwin; Mark
Attorney, Agent or Firm: Chung; Wei Te
Description
The patent or application file contains at least one drawing
executed in color. Copies of this patent or patent application
publication with color drawing(s) will be provided with color
drawing(s) will be provided by the Office upon request and payment
of the necessary fee.
FIG. 1 is a perspective view of a computer motherboard packaging
box of our new design;
FIG. 2 is a side elevational view thereof;
FIG. 3 is a side elevational view thereof from the side opposite
that shown in FIG. 2;
FIG. 4 is an end elevational view thereof;
FIG. 5 is an end elevational view thereof from the end opposite
that shown in FIG. 4;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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