Computer motherboard packaging box

Description

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a perspective view of a computer motherboard packaging box of our new design;

FIG. 2 is a side elevational view thereof;

FIG. 3 is a side elevational view thereof from the side opposite that shown in FIG. 2;

FIG. 4 is an end elevational view thereof;

FIG. 5 is an end elevational view thereof from the end opposite that shown in FIG. 4;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

CLAIM The ornamental design for a computer motherboard packaging box, as shown and described.

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Inventors:	Chen; Jing-Qun (Shenzhen, CN), Liang; Chun-Chi (Tu-Chen, TW), Xu; Yun-Dong (Shenzhen, CN)
Assignee:	Hon Hai Precision Ind. Co., Ltd (Taipei Hsien, TW)
Appl. No.:	D/217,197
Filed:	November 15, 2004

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Foreign Application Priority Data

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Jun 28, 2004 [CN]			2004300438352

Current U.S. Class:	D9/432
Current International Class:	0903
Field of Search:	;D9/414,430-432,715,721 ;229/116.1,116.5,87.19,100,923,124,126,128 ;206/459.5,438,570,575 ;220/9.1-9.3,780

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References Cited [Referenced By]

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U.S. Patent Documents

D382478	August 1997	Park
D428335	July 2000	Toyota et al.
D453002	January 2002	Mansau
D453682	February 2002	Kusumi et al.
D453683	February 2002	Kusumi et al.
D482279	November 2003	Waldburger et al.

Primary Examiner: Reid; Stella
Assistant Examiner: Goodwin; Mark
Attorney, Agent or Firm: Chung; Wei Te