U.S. patent number D537,816 [Application Number D/230,603] was granted by the patent office on 2007-03-06 for radio-frequency module for a communication device.
This patent grant is currently assigned to Taiyo Yuden Co., Ltd.. Invention is credited to Hideyuki Maruyama.
United States Patent |
D537,816 |
Maruyama |
March 6, 2007 |
Radio-frequency module for a communication device
Claims
CLAIM The ornamental design for a radio-frequency module for a
communication device, as shown and described.
Inventors: |
Maruyama; Hideyuki (Nakamuroda
Haruna-Machi, JP) |
Assignee: |
Taiyo Yuden Co., Ltd. (Tokyo,
JP)
|
Appl.
No.: |
D/230,603 |
Filed: |
May 24, 2005 |
Foreign Application Priority Data
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|
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Nov 26, 2004 [JP] |
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2004-039391 |
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Current U.S.
Class: |
D14/240 |
Current International
Class: |
1403 |
Field of
Search: |
;D14/240,242,246,192,223,140.1,140.4,356,358 ;D13/184,123
;181/129-130
;379/430,431,433.01,420.03,957,52,106.1,333-337,387.01,399.01,413.02,413.04
;455/569.1,510,524 ;439/717 ;D26/139,135,120 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Rademaker; Charles A.
Attorney, Agent or Firm: Knobbe Martens Olson & Bear
LLP
Description
FIG. 1 is a front elevation of an radio-frequency module for a
communication device showing my new design;
FIG. 2 is a rear elevation thereof;
FIG. 3 is a right side elevation thereof the side opposite being a
mirror image;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a bottom perspective view thereof.
The broken line showing of portions of the design is for
illustrative purposes only and forms no part of the claimed
design.
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