Electromagnetic valve assembly

Miyazoe , et al. November 28, 2

Patent Grant D532865

U.S. patent number D532,865 [Application Number D/214,694] was granted by the patent office on 2006-11-28 for electromagnetic valve assembly. This patent grant is currently assigned to SMC Corporation. Invention is credited to Shinji Miyazoe, Katsuyuki Senba.


United States Patent D532,865
Miyazoe ,   et al. November 28, 2006

Electromagnetic valve assembly

Claims

CLAIM The ornamental design for an electromagnetic valve assembly, as shown and described.
Inventors: Miyazoe; Shinji (Ibaraki, JP), Senba; Katsuyuki (Ibaraki, JP)
Assignee: SMC Corporation (Tokyo, JP)
Appl. No.: D/214,694
Filed: October 8, 2004

Foreign Application Priority Data

Apr 9, 2004 [JP] 2004-011002
Current U.S. Class: D23/233
Current International Class: 2301
Field of Search: ;D23/233-249 ;D15/7,199 ;137/554,557,560,882,884,269,271,343,625.64 ;251/596.13,596.16,331,219,15,130,129.04 ;4/304

References Cited [Referenced By]

U.S. Patent Documents
D417717 December 1999 Hayashi et al.
D424166 May 2000 Hayashi et al.
D428111 July 2000 Hayashi et al.
6164335 December 2000 Hayashi et al.
6520202 February 2003 Miyazoe et al.
D479738 September 2003 Hayashi et al.
6796329 September 2004 Swenson, Jr.
7073825 July 2006 Takada et al.

Other References

US. Appl. No. 29/214,701, filed Oct. 8, 2004, Miyazoe et al. cited by other.

Primary Examiner: Simmons; Ian
Assistant Examiner: Stevens; Maurice
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.

Description



FIG. 1 is a top and right front perspective view of an electromagnetic valve assembly, showing our design;

FIG. 2 is a top and left rear perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

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