U.S. patent number D526,894 [Application Number D/203,151] was granted by the patent office on 2006-08-22 for package.
This patent grant is currently assigned to Matsushita Electric Industrial Co., Ltd. Invention is credited to Shinsuke Hamuro, Kunio Hoshino.
United States Patent |
D526,894 |
Hamuro , et al. |
August 22, 2006 |
Package
Claims
CLAIM We claim the ornamental design for a package, as shown and
described.
Inventors: |
Hamuro; Shinsuke (Ikoma,
JP), Hoshino; Kunio (Kusatsu, JP) |
Assignee: |
Matsushita Electric Industrial Co.,
Ltd (Osaka, JP)
|
Appl.
No.: |
D/203,151 |
Filed: |
April 9, 2004 |
Foreign Application Priority Data
|
|
|
|
|
Nov 17, 2003 [JP] |
|
|
2003-034210 |
|
Current U.S.
Class: |
D9/432 |
Current International
Class: |
0903 |
Field of
Search: |
;D9/432,433,414,423,499
;206/459.1,459.5,525,527 ;229/100,124,103.3,153,800 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Reid; Stella
Assistant Examiner: Goodwin; Mark
Attorney, Agent or Firm: Brinks Hofer Gilson & Lione
Description
The patent or application file contains at least one drawing
executed in color. Copies of this patent with color drawings will
be provided by the United States Patent and Trademark Office upon
request and payment of the necessary fee.
FIG. 1 is a top perspective view of a package of the present
invention;
FIG. 2 is a front view thereof, wherein the rear view is a mirror
image thereof;
FIG. 3 is a first side view thereof, wherein the second side view
is a mirror image thereof;
FIG. 4 is a top view thereof; and,
FIG. 5 is a bottom view thereof.
* * * * *