Circuit board
Enderlein , et al. July 18, 2
U.S. patent number D525,213 [Application Number D/180,813] was granted by the patent office on 2006-07-18 for circuit board. This patent grant is currently assigned to Siemens Aktiengesellschaft. Invention is credited to Janos-Gerold Enderlein, Jorg Romahn.
| United States Patent | D525,213 |
| Enderlein , et al. | July 18, 2006 |
Circuit board
Claims
CLAIM The ornamental design for a circuit board, as shown and described.
| Inventors: | Enderlein; Janos-Gerold (Berlin, DE), Romahn; Jorg (Berlin, DE) |
|---|---|
| Assignee: | Siemens Aktiengesellschaft
(Munich, DE) |
| Appl. No.: | D/180,813 |
| Filed: | May 1, 2003 |
Foreign Application Priority Data
| Nov 1, 2002 [DE] | 402 09 144 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;29/829,843 ;174/250,254,260,265 ;361/720,736,748,760,761,773 |
References Cited [Referenced By]
U.S. Patent Documents
| 4651416 | March 1987 | DePaul |
| D292698 | November 1987 | DeVita et al. |
| 5148350 | September 1992 | Chan et al. |
| 5296652 | March 1994 | Miller, Jr. |
| 5903441 | May 1999 | Dean et al. |
| 6235995 | May 2001 | Cheng et al. |
| 6479755 | November 2002 | Kim et al. |
| 6606250 | August 2003 | Shi |
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Morrison & Foerster LLP
Description
FIG. 1 is a front perspective of the invention.
FIG. 2 is a plan elevation of the invention.
FIG. 3 is a bottom plan of the invention.
FIG. 4 is a front elevation of the invention.
FIG. 5 is a rear elevation of the invention.
FIG. 6 is a right end elevation of the invention; and,
FIG. 7 is a left end elevation of the invention.
The broken lines define the boundary of the claimed design and form no part of the claimed design.
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