Wire solder applicator

Ishii , et al. March 21, 2

Patent Grant D517384

U.S. patent number D517,384 [Application Number D/209,789] was granted by the patent office on 2006-03-21 for wire solder applicator. This patent grant is currently assigned to Pentel Kabushiki Kaisha, Senju Metal Industry Co., Ltd.. Invention is credited to Kou Ishii, Yoshiaki Yanagawa.


United States Patent D517,384
Ishii ,   et al. March 21, 2006

Wire solder applicator

Claims

CLAIM The ornamental design for a wire solder applicator, as shown and described.
Inventors: Ishii; Kou (Tokyo, JP), Yanagawa; Yoshiaki (Tokyo, JP)
Assignee: Pentel Kabushiki Kaisha (Tokyo, JP)
Senju Metal Industry Co., Ltd. (Tokyo, JP)
Appl. No.: D/209,789
Filed: July 21, 2004

Foreign Application Priority Data

Jan 22, 2004 [JP] 2004-001394
Current U.S. Class: D8/30
Current International Class: 0805
Field of Search: ;D8/30 ;219/229,230,227 ;228/41,52,53

References Cited [Referenced By]

U.S. Patent Documents
D266980 November 1982 Fortune
4793541 December 1988 Dravnieks
5031817 July 1991 Chen
5379941 January 1995 Partel
5782394 July 1998 Langley
5813591 September 1998 Quinn et al.
6369359 April 2002 Morrison
Primary Examiner: Hyder; Philip S.
Attorney, Agent or Firm: Adams & Wilks

Description



FIG. 1 is a perspective view of a wire solder applicator showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a left side view thereof; and,

FIG. 6 is a right side view thereof.

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